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About 800 results for "memory chip module"

New ARBOR COM Express Compact Module with Single-chip, Quad-co...

ARBOR Technology, a leading provider of embedded computing solutions, announces the release of the EmETXe-i2309 COM Express Compact module. The EmETXe-i2309 is based on the new Intel® Atom processors E3800 family (formerly codenamed Bay Trail). ... Embedded Computing Design, 1 day ago

2 images for "memory chip module", 3 weeks ago
Softpedia, 3 weeks ago

3-D TSV semiconductor memory under production by Samsung

Date: 31/08/2014 Samsung said it has started the production of DRAM memory modules made using DDR4 DRAM ICs fabricated using three-dimensional through silicon via (TSV) semiconductor technology. The new RDIMMs modules find more application in ...
 Electronics Engineering Herald3 weeks ago Samsung to mass produce 6Gb LPDDR3 chips using 20nm fabrication process  Tech24 days ago Samsung Mass Produces 20-Nano Mobile DRAM - Should Micron Be Worried?  Seeking Alpha5 days ago Samsung mass-produces first 20nm mobile DRAM  Korea Herald5 days ago

Kilopass Recruits Bruce Bateman for Development of the Next-Generation Memory

People Power Company , an energy efficiency solutions company, today announced the SuRF Block, a one inch square module that companies can embed into electronics to wirelessly connect them to the Internet. Offering the first open source ...
 Embedded Computing Design1 week ago
Embedded Technology Journal

Avnet Electronics Marketing Releases PicoZed System-On-Module

PHOENIX--( With the launch of PicoZed, Avnet is providing a cost-effective alternative to chip-down SoC design @AvnetDesignWire expands support for @XilinxInc Zynq®-7000 All Programmable SoC with new PicoZed line. Leveraging ...
 EON: Enhanced Online News2 weeks ago Atmel Expands World-class Wireless Portfolio With 802.11b/g/n Wi-Fi SoCs and Modules  TMC Net5 hours ago ATMEL : Expands World-class Wireless Portfolio With 802.11b/g/n Wi-Fi SoCs and Modules  4 Traders1 day ago AVNET : Electronics Marketing Releases PicoZed System-On-Module  4 Traders2 weeks ago

First 20nm 6 Gb DDR3 Memory for Laptops Launched by Samsung

Most DDR3 modules, all memory modules really, have a capacity that is of 1 GB, 2 GB, or a multiple of 2 GB. However, Samsung has introduced a technology that will debut as part of an unusual 3 GB module instead. Essentially, Samsung has become the ...
 Softpedia5 days ago Samsung Begins Mass Producing 3D TSV Technology Based DDR4 Modules for Enterprise Servers  Individual.com2 weeks ago
Korea Herald

SK hynix develops fastest mobile chip

SK hynix's wide IO2 mobile DRAM SK hynix, the world's second-largest memory chipmaker, said Wednesday that it has successfully developed the industry's fastest mobile dynamic access memory. The so-called wide input/output 2 DRAM is built on ...
 Korea Herald2 weeks ago SK Hynix SH910A SSD 256GB Review  Bit-Tech.net1 week ago
Computer Weekly

Grantley-powered Xeon servers pack DDR4 memory

A number of new servers powered by Intel's recently launched 18-core Xeon E5-2600 v3 (Grantley) chip were announced at IDF 2014. As IDG's Agam Shah notes, the servers, debuted by Hewlett-Packard, Dell, Lenovo and IBM, are the very first to pack DDR4 ...
 Noodls3 hours ago Rambus : Grantley-powered Xeon servers pack DDR4 memory  4 Traders3 hours ago Intel is making waves in the growing microserver market  Computer Weekly1 week ago

Three-in-one graphics chip dumps frame buffer memory

The FT801 combines display, audio, and touch operations into a single chip, providing an optimised solution that reduces power, board area, and Bill of Material (BOM) costs. It targets intelligent QVGA and WQVGA displays with a maximum 512x512 ...
 Electronic Specifier5 days ago Mouser Three-in-one embedded video engine covers graphics, touch and audio  Electropages.com4 days ago Mouser Electronics now supplies the FDTI FT801 three-in-one graphics controller chip  Source.theEngineer5 days ago RESET definition and circuit implementation inside an Automotive Electronic Control Unit  EDN.com1 week ago

Patent Issued for Modular Re-Configurable Profiling Core for Multiprocessor Systems-On-Chip

By a News Reporter-Staff News Editor at Computer Weekly News -- From Alexandria, Virginia , VerticalNews journalists report that a patent by the inventors Shannon, Lesley Lorraine ( Burnaby , CA); Fedorova, Alexandra ( Vancouver , CA), filed on ...
 HispanicBusiness.com2 weeks ago Patent Issued for Mapping Virtual Addresses to Different Physical Addresses for Value Disambiguation for Thread Memory Access Requests  HispanicBusiness.com6 days ago SAMSUNG ELECTRONICS : Patent Issued for Hybrid Memory Device, System Including the Same, and Method of Reading and Writing Data in the Hybrid Memory Device  4 Traders1 week ago PHISON ELECTRONICS : Researchers Submit Patent Application, "Reference Frequency Setting Method, Memory Controller and Memory Storage Apparatus", for Approval  4 Traders1 week ago
TechWeekEurope UK

IDF 2014: Intel Starts Shipping Edison Compute Module

Intel has started shipping the Edison compute module a tiny development board that features 1GB of RAM, 4GB of flash memory, built-in wireless and a dual-core Atom CPU capable of basic processing tasks to customers in the US. Edison was created ...
 TechWeekEurope UK1 week ago
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