Hynix DDR4 chips, memory modules and a wafer. Credit: S.K. Hynix SK Hynix, the world's second-largest memory chip maker, announced that it plans to invest $38.9 billion to build three new semiconductor fabrication plants by 2024. South Korea-based ... Computerworld Malaysia, 6 days ago
Hats Off to Hynix: Inside 1st High Bandwidth Memory - EE Times, 1 month ago
More from: MIS Asia, CIO-Asia...and 1 other sources
2 images for "memory chip module"
Image courtesy of Stuart Miles at FreeDigitalPhotos.net August 19, 2015 0 BENGALURU, INDIA: Rambus has introduced the R+ DDR4 server memory chipset RB26, for RDIMMs and LRDIMMs, targeted at both the enterprise and data center server markets. ...Cyber India Online, 2 weeks ago Rambus to Begin Making Memory Chipsets Electronics360, 2 weeks ago Rambus starts making DDR4 modules for servers VR Zone, 2 weeks ago Rambus unveils its first R+ chips for server memory modules KitGuru.net, 2 weeks ago
Although Intel Corp.'s latest Skylake microprocessors officially support only DDR4 and DDR3L memory technologies, Asustek Computer claims that its Intel Z170-based motherboards with 240-pin DIMM slots will work with standard DDR3 memory modules with ...KitGuru.net, 3 weeks ago Intel: First 3D XPoint SSDs will feature up to 6GB/s of bandwidth KitGuru.net, 5 days ago Intel, Micron: My Thoughts On 3D X Point Memory Seeking Alpha, 1 month ago Part III - 3D XPoint new server storage memory from Intel and Micron Sys-Con Media, 1 month ago
ARBOR Technology, a leading technology company for embedded computer modules , single board computers and EDM services, is expanding its successful line of modules with the introduction of a 5th generation Intel® Core processor platform, the ...Industrial Embedded Systems, 1 month ago Express Compact module built around Intel Core i7-5650U processor EE Times Europe, 1 month ago Type 6 Compact Module consumes just 15 W TDP. ThomasNet, 1 month ago COM Express Compact Module leverages Intel Core i7-5650U CPU. ThomasNet, 1 month ago
Diablo Technologies Launches Memory1, World's First All-Flash DDR4 Memory Module, Transforming Datacenter Performance And Economics
Leverages the price and capacity of flash to quadruple system memory, enabling dramatic reductions in server count SAN JOSE, Calif., Aug. 5, 2015 /PRNewswire/ --Diablo Technologiestoday announced the launch of Memory1, the first all-flash server ...Fat Pitch Financials, 4 weeks ago Diablo Technologies' Memory1 Honored With Two Awards At The Big Data World Forum TMC Net, 1 week ago Diablo Technologies' Memory1 Wins 'Most Innovative Flash Memory Technology' At Flash Memory Summit Crawford Financial Planning, 2 weeks ago AgigA Tech To Demonstrate NVDIMM Technology At 2015 Flash Memory Summit TheStreet.com, 3 weeks ago
Memory module firms Adata Technology and Transcend Information have reported sequential increases in July consolidated revenues at 3.9% and 6.7%, respectively. Adata posted revenues of NT$1.55 billion for July 2015. Sales of its DRAM products ...DigiTimes Taiwan, 3 weeks ago Transcend Announces 16GB DDR3L Memory Modules Digital Terminal, 1 month ago Transcend releases new 16GB DDR3L Memory Modules VAR India, 1 month ago
RANCHO SANTA MARGARITA, CALIF.--(BUSINESS WIRE)-- Virtium, a solutions-driven provider of industrial memory and embedded SSD storage products, today announced an updated family of its DDR4 Mini-RDIMM and UDIMM memory modules based on JEDEC ...Embedded Technology.com, 1 month ago
Although DDR4 memory provides higher bandwidth than DDR3 and has very high overclocking potential, it is also more expensive than its predecessor. However, Intel Corp.'s latest Skylake processors officially support only DDR4 and DDR3L, but not DDR3.KitGuru.net, 13 hours ago Corsair demos 4GHz DDR4 memory modules at IDF KitGuru.net, 2 weeks ago DDR4 memory hits 4838MHz with LN2 cooling, Gigabyte Z170X-SOC Force mainboard KitGuru.net, 2 weeks ago KLEVV Neo 1600MHz 16GB DDR3 Memory Kit Review ETeknix.com, 1 month ago
_ 3D TSV technology is expected to reach $4.8B This registered dual Inline memory module (RDIMM) includes 36 DDR4 DRAM chips (ref. K4AAG045WD), each of which consists of four 4Gb DDR4 DRAM dies (Ref. K4A4G085WD). The chips are manufactured using ...Sys-Con Media, 1 month ago Samsung 3D TSV stacked DDR4 DRAM: the first analyzed memory product with via- middle TSV ElectroIQ, 1 month ago Research and Markets: Global High-Density Packaging (MCM, MCP, SIP, 3D-TSV): Market Analysis and Technology Trends 2015 Sys-Con Media, 1 day ago Electronic Components Market 39 Company Profiles and 2020 Forecasts in New Global (China, Japan, EU, US) Research Reports Sys-Con Media, 1 week ago
At its annual Developer Forum Tuesday, Intel demonstrated a host of new use cases for its button-sized Curie wearable module. Intel has developed the tiny device as a low-power base for consumer and industrial wearables, debuting it first at CES in ...Yahoo! News, 2 weeks ago Intel Shows Off Curie Wearable Chip With Bicycle Stunts And An Army Of Dancing Robot Spiders Tech Times, 1 week ago
on your WebpageAdd Widget >Get your members hooked!