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About 118 results for "sdio"

Silex Technology Introduces Its 5th Generation 802.11ac SDIO W...

Silex Technology America, Inc. , a global leader in wired and wireless networking solutions, today introduced its newest embedded Wi-Fi module, the SX-SDMAC . The dual-band, single stream, 802.11a/b/g/n/ac plus Bluetooth "Smart Ready" module is ... Medical Design Technology, 1 month ago

1 images for "sdio"

VideoBasedTutorials, 2 months ago


San Jose, CA - Arasan today announced the immediate availability of its MIPI I3C Master & Slave IP cores compliant to the just released MIPI I3C Specification Ver 1.0. MIPI I3C is a chip-to-chip interface that can connect all sensors in a device ...
 EDA Café7 hours ago Arasan Chip Sytems Announces Xilinx Alliance Program Membership  EDA Café1 month ago XILINX : Arasan Chip Sytems Announces Xilinx Alliance Program Membership  4 Traders1 month ago Arasan Announces MIPI C-PHY IP Core compliant to the latest C-PHY v1.1 Specifications  EDA Café1 month ago

PORTWELL : Releases New Qseven 2.1 Module with x86 Based Processor

Portwell announced its newest Qseven 2.1 module with x86 based processor. The model series named as PQ7-M108 (70x70mm), is based on the latest Intel 14nm Atom, Celeron and Pentium processors (codenamed Apollo Lake). The new Intel Atom E3900 series ...
 4 Traders4 days ago Portwell: Qseven 2.1 module with Intel Atom E39xx series, Pentium and Celeron processors  ECE1 month ago Portwell: SMARC module with x86 based processor  ECE1 month ago MSC presents further ARM based Qseven Module Family  Electronic Specifier1 month ago

MEDIATEK : Announces the MT2533D Chipset with Advanced Technology for Smart Headsets, Headphones and Hands-Free Systems

- MediaTek today announced the availability of MT2533D, a highly integrated chipset for smart, connected headphones, headsets, earpieces and hands-free systems. The MT2533D is designed for wireless headphones and in-vehicle hands-free systems, ...
 4 Traders6 days ago MT2533D Chipset delivers DMNR technology using DSP.  ThomasNet1 week ago Mediatek launches MT2533D chipset for smart h...  Dotemirates.com1 week ago MediaTek Announces the MT2533DChipset with Advanced Technology for Smart Headsets, Headphonesand Hands-Free Systems  It Voice1 week ago

DSPs target power constrained applications

The devices open the way for designers to incorporate 16- and 32-bit processing in a range of new embedded vision use cases, including industrial imaging and building controls as well as portable and automotive audio. Advanced connectivity options ...
 Electronic Specifier1 week ago

Multicore SHARC processors deliver 24GFLOPS under 2W

The ADSP-SC58x and ADSP-2158x series consume less than 2W at high temperature, making the line-up more than five times more power efficient than previous SHARC products and more than two times more efficient than the nearest competitive processors.
 Electronic Specifier1 week ago

SparkLAN Launches WSDQ-103GN/GNI 802.11b/g/n Wi-Fi IOT Module 2017-01-05 Taipei, Taiwan, January 05, 2017 --( )-- SparkLAN Communications, Inc., an embedded wireless M2M (machine to machine) networking solution provider, for the next generation of connected smart products, is introducing two ...
 BizWire Express1 week ago SparkLAN Launches WSDB-104GNI(BT) Industrial-Grade 802.11b/g/n Single-Band IoT / Bluetooth Card for Wireless Connectivity Applications  BizWire Express2 weeks ago

NXP Semiconductors : i.MX 8M Processor Poised to Transform IoT Audio, Voice and Video Interactions

News Highlights New LPC800 and LPC54000 series MCUs help ensure a robust pipeline of ARM® Cortex®-M-based devices for next-generation consumer and industrial IoT applications NXP announces the first of five new LPC microcontroller families slated ...
 4 Traders1 week ago NXP Strengthens Its MCU Leadership with a Strong Pipeline of Innovative LPC Microcontrollers  Benzinga.com1 week ago NXP SEMICONDUCTORS : Strengthens Its MCU Leadership with a Strong Pipeline of Innovative LPC Microcontrollers  4 Traders1 week ago
Sys-Con Brasil

INTRINSYC TECHNOLOGIES : Introduces Next Generation System on Module based on Qualcomm Snapdragon 820 Processor

VANCOUVER, BC -- (Marketwired) -- 12/30/16 -- Intrinsyc Technologies Corporation (TSX: ITC) (OTC: ISYRF) ("Intrinsyc" or the "Company"), a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) ...
 4 Traders2 weeks ago Intrinsyc Technologies Introduces Next Generation System on Module based on Qualcomm Snapdragon 820 Processor  Financial Buzz2 weeks ago

​Multiradio modules supporting dual band Wi-Fi & dual-mode Bluetooth

Made ready to embed the host-based multiradio ODIN-W16 is suitable for industrial, vehicle, medical and security applications. Designed for a long life cycle Compact 15 x 22 x 3 mm Ultra-low power consumption Pre-calibrated radio parameters ... weeks ago
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